Mgo-c brick
Manufacture:
1.use the large crystal、fused magnesia(high-purity magnesia) and high-purity
Graphite as raw materials;
2. make the phenolic resin as the binder, add variety of additives
3. to form by high-pressure and high temperature..
Product features:
1. high refractoriness, excellent anti-oxidation, high strength, perfect thermal
Stability;
2. resist the erosion and spall, high abrasion- resistance strength , perfect ability
Of anti-slag;
3. difficult to oxidation and hydration, can be used for long time.
Product application:
1. used for the furnace wall and working lining of all kinds of furnace;
2. used for the slag line for the ladle and eaf...
Sncuinagsbbiznfealascd99.3±0.10.7±0.1< 0.01< 0.0001< 0.02< 0.01< 0.005< 0.02< 0.02< 0.03< 0.002the Sn99.3cu0.7 Lead Free Solder Bar Is Made Up Of 99.7% Tin And 0.7% Copper. It Is Desirable For Use In Common Metal Equipment, Copper Tubes, And Copper Plates. This Product Is A Conventional Type Of Environmentally-friendly Solder By Adoption Of Lead-free Soldering Technology.as A Typical Type Of High-temperature Lead Free Tin Bar, Our Sn99.3cu0.7 Lead Free Solder Has The Melting Point Of Approximately 227 Degrees Celsius. It Is Suitable For Both Wave Soldering And Dip Soldering Processes, Which Call For Environmental Protection. During The Soldering Process, This Product Features Nice Liquidity. It Can Substantially Reduce Various Technical Problems, Such As Bridging, Icicle, Solder Spatter, And More.featureseutectic Alloy.bridge-free And Icicle-free Soldering.smooth, Bright, Well-formed Fillets, Free Of Gross Micro-cracks, Irrespective Of The Cooling Rate.good Through-hole Penetration.good Topside Fillet Formation.dross Rate Equal Or Lower Than Tin-lead Solder.does Not Require A Nitrogen Atmosphere.does Not Erode Copper From Holes, Pads And Tracks.low Rate Of Copper Leaching Makes It Easy To Control The Copper Content Of The Solder Bath.lower Aggressiveness To Stainless Steel And Other Solder Pot Materials As Compared To Tin-silver-copper Alloys.thermal Fatigue Resistance And Creep Strength Better Than Tin-lead.slow, Even Growth Of The Intermetallic Layer At The Solder/substrate Interface.also Performs Well In Selective And Dip Soldering.applicationsdip Soldering Or Wave Soldering Of Electronic Components Such As Pcba, Thtsoldering Of Metals, Such As Copper Roofing Joineryassembly Of Stained Glass, Silver Jewelry Etcother Generally Tinning Purpose....
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